A Strain-absorbing Design for Tissue–machine Interfaces Using a Tunable Adhesive Gel

Author: Sungwon Lee, Takao Someya et al.

Affiliation: The University of Tokyo, Japan Science and Technology Agency (JST)

Publication date: 2014.12.19

Summarized by Seongmin Park

 

– Structure
v. 1.4 μm PET substrate, 20 nm Au word line, 50 nm Au bit line, 30 nm DNTT active layer, 200 nm parylene gate dielectric layer

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Fig. 1

v. Only the area covered by photopatterned gel maintains an adhesive contact during measurement  the floating parts of the device absorb strain

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Fig. 2

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Fig. 3

 

–Adhesive gel property
v. adhesion strength: Adhesion strength is enough for supporting a coin (5g)

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Fig. 4

v. Adhesive gel constituents

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Fig. 5

v. Properties controlled by PVA concentration

1. Modulus of adhesive gel

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Fig. 6

2. Adhesion strength vs. glass

 

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Fig. 7

3. Resistance and capacitance (Dashed line represents the capacitance.)

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Fig. 8

– Results
v. OTFT performance: 10 times 100% compressive strainàremains its performance

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Fig. 9

v. Device on a balloon: Can endure ~100% compressive strain

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Fig. 10

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Fig. 11

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