Self-assembled three dimensional network designs for soft electronics

Journal: Nature communications

Author: Kyung-In Jang and John A. Rogers et al.

Affiliation: Daegu Gyeongbuk Institute of Science and Technology, Northwestern University

Publication date: 2017.06.21

Summarized by Jinpyeo Jeung


– 3D helical coil (Fig.1)
v. 2D structures limit performance for systems that require low modulus, elastic mechanics in compact designs.
v. 2D precursors spontaneously transform into desired 3D shapes.
v. Compressive forces induced by releasing the prestrain cause the 2D precursor to geometrically transform.
v. Two ends include small discs that form strong covalent siloxane bonds to and substrate.


Fig. 1


– Result
v. Enables high levels of strechability and mechanical robustness, without the propensity for localized crack formation or fracture.
v. The elastic stretchability of the 3D helices significantly exceeds that of the 2D serpentines. (Fig.2)
v. Deformations of the 2D serpentine lead to sharp, unavoidable stress concentrations at the arc regions but 3D helices shows uniform stress. (Fig.3)


Fig. 2


Fig. 3


– Application
v. Actual appearance. (Fig. 4, Fig. 5)
v. It can be applied to various wireless, skin-compatible electronics. (Fig. 6)


Fig. 4


Fig. 5


Fig. 6