Fully Printable, Strain-engineered Electronic Wrap for Customizable Soft Electronics

Journal: Scientific Reports

Publication date: 2017. 03. 24

Summarized by Inyeol Yun

 

– Concept

v. PDMS-PRI-PDMS Structure (Fig. 1)

v. Devices (LEDs, IC Chips) are mounted on PRI (Printed Rigid Island).

v. Concept from stretchable beat network (Fig. 2)

v. Device (bead) is stable because stress is concentrated on PDMS (spring) when mechanical deformation is applied to the wrap. (Fig. 3)

v. Printed silver wire was encapsulated by PDMS -> prevent silver wire deformation

fig1

Fig. 1

fig2

Fig. 2

fig3

Fig. 3

 

– Fabrication

v. Fabrication process of the PRI-embedded soft wrap (Fig. 4)

v. Devices were bonded with inkjet-printed Ag pads via Ag epoxy. (Fig. 5)

fig4.png

Fig. 4

fig5

Fig. 5

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